WaferVision HSM-200
for High-Precision Wafer Inspection
Cleanroom-Compatible High-Speed Measurement System for Wafer Thickness and Surface Topography in the Semiconductor Industry.
This high-speed measurement system enables precise thickness and surface determination of silicon wafers. It ensures highly homogeneous wafer batches for downstream polishing processes while maintaining an extremely high throughput.
130
Wafer Pro per hour
50 NM
Repeatability Thickness
4‘ to 8’
wafer size
ISo 5
suitable for cleanrooms
The Challenge
Homogeneous Wafer Batches for Optimal Polishing Results
To achieve optimal, uniform polishing runs in semiconductor manufacturing, the wafers used must feature an exceptionally homogeneous thickness distribution. The customer faced the challenge of precisely sorting and classifying high volumes of wafers prior to polishing to prevent uneven processing and costly scrap.
At the same time, the modern production environment demanded seamless software integration with the factory host system and strict compliance with cleanroom standards, all without sacrificing measurement speed.
The Requirement: A fully automated, cleanroom-compatible inspection system that captures wafer thickness and surface topography with sub-micrometer accuracy, communicates with existing manufacturing execution systems, and guarantees high throughput.
The Solution
Sub-Micrometer Precision at High Speed
The WaferVision HSM-200 provides a highly innovative measurement solution that inspects up to 130 wafers per hour with a thickness repeatability of 50 nm. Certified for ISO Class 5 cleanroom environments, the system features a SECS/GEM interface, making it fully ready for smart factory integration.
Measurement Method
Wafer thickness and surface topography measurement
Measurement accuracy: topography
Compressed air (preliminary test) · Helium (precision leak detection)
Throughput
130 wafers per hour
Supported Component Types
Wafer sizes from 4" to 8"
Measurement accuracy: thickness
0.1 micrometre accuracy
Integration & Software
SECS/GEM ready for automated factory communication
Thickness Repeatability
50 NM
Cleanroom Class
Cleanroom compatible per ISO Class 3
Test methods used
These processes have been combined for this plant and can also be used individually, depending on requirements.
Wafer inspection
to record geometric properties and ensure quality throughout the entire manufacturing process.
Typical applications:
- Wafer qualification
- Process monitoring during semiconductor manufacturing
- Final inspection
- of silicon, compound semiconductor and other flat substrates
- for measuring parameters such as thickness, warp, bow and TTV
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Helium Leak Testing System
- 8 s helium leak detection cycle time per component
- 10⁻⁶ mbar·l/s detectable leak rate (helium)
- 5 bar test pressure with 10% helium
Zone Melting System
Get Expert Advice
Do you have questions or are you unsure which system is the right fit for your requirements? No problem. We are happy to advise you personally and work with you to find the ideal solution for your application. Benefit from our years of experience, an honest assessment, and professional guidance — tailored to your needs and with no obligation.
Contact person
Michael Landgraf
Managing Director
- m.landgraf@aprotec-gmbh.de
- +49 9353 982460-11